Encapsulation machine 3

5. Mold group:

1. The mold is fixed in the mold chute by four screws to facilitate mold replacement of different types of modules

2. During punching, the cylinder is pushed from bottom to top to ensure that the module burr is downward during packaging,

3. The flushed module is sucked up by the front and rear cylinders of transfer and transported up and down by vacuum suction cups, and its position and stroke can be adjusted.

6. Transfer station: the position of the transferred module is corrected at the transfer station, which can be precisely adjusted by fine-tuning the nut. Adjustable transfer station platform correction block with modules of different sizes.

7. Spot welding group: it is used to bond the module with the card base milled for the first time to avoid the module displacement due to vibration during card handling. The whole group is driven by the cylinder and heated by the heating pipe, which is controlled by the temperature sensor and temperature controller. Spot welding time is controlled by touch screen input. The spot welding position can be changed by adjusting the position of aluminum plate.

8. Thermal welding group: the thermal welding head is pushed up and down by the air cylinder, and the heat is provided by the heating hoop. The heating temperature is controlled by the cooperation of the temperature sensor and the temperature controller. The thermal welding head uses a small amount of spring to avoid damaging the module or uneven welding due to different card thickness. The relative position between the welding head and the card can adjust the right and first two eccentric positioning pins of the card clamp of the thermal welding group, The horizontal position of the clamp can be adjusted by four headless screws (jacking wire). The hot welding head can be divided into eight contact and six contact hot welding heads according to different modules. Similarly, there are two kinds of hot welding: double group and single group.

9. Cold welding group: this group mainly cools and flattens the IC module after hot welding to accelerate its bonding action.

10. IC detection group after packaging: detect whether the IC is sealed into the slot on the card, and detect the opening and short circuit electrical function. If the function is bad, throw the card into the waste box.

11. Receiving group: send the cards to the receiving clip and arrange the cards neatly by pushing the air cylinder.