Packaging machine is a kind of smart card production equipment. The module is firmly pasted in the slot hole on the card conforming to ISO standard after a certain time and pressure hot welding with hot melt adhesive.
Encapsulation Machine is generally used for IC card and SIM card encapsulation. It can be realized according to different settings One card, one chip, one card, multi chip package.
Generally speaking, the packaging machine consists of the following parts:
1. Feeding group: put the card into the cassette, and the card is pulled down to the transfer arm by the card pulling cylinder using the vacuum suction cup.
2. Material rack group: after putting the chip hot-melt adhesive tape on the material rack correspondingly, the chip hot-melt adhesive is introduced into the glue punching paper mold, pre welding group, punching chip group, etc. through the Guide Wheel, and the punched strips are respectively introduced into the corresponding positions.
3. Pre welding group: it is heated by the heating element, and the temperature sensor (thermocouple) and temperature controller cooperate to control the heating temperature. The pre welding time is set by the touch screen. The pot welding head carries out hot melt adhesive and module back adhesive under the action of the cylinder. According to different modules, the corresponding pot welding head shall be replaced, such as eight contacts and six contacts.
4. Module quality identification group: the reflection electric eye senses the bad module identification hole (a small round hole punched by the module manufacturer on individual bad modules when leaving the factory) and sends the signal to the PLC. If the perforated module signal is received, the PLC will send the bad module signal to the die punching group. The die will not punch some modules, and the card corresponding to this module will not be spot welded or hot welded, When the IC inspection group is packaged, the card is sent to the waste box.
5. Mold group:
1. The mold is fixed in the mold chute by four screws to facilitate mold replacement of different types of modules
2. During punching, the cylinder is pushed from bottom to top to ensure that the module burr is downward during packaging,
3. The flushed module is sucked up by the front and rear cylinders of transfer and transported up and down by vacuum suction cups, and its position and stroke can be adjusted.
6. Transfer station: the position of the transferred module is corrected at the transfer station, which can be precisely adjusted by fine-tuning the nut. Adjustable transfer station platform correction block with modules of different sizes.
7. Spot welding group: it is used to bond the module with the card base milled for the first time to avoid the module displacement due to vibration during card handling. The whole group is driven by the cylinder and heated by the heating pipe, which is controlled by the temperature sensor and temperature controller. Spot welding time is controlled by touch screen input. The spot welding position can be changed by adjusting the position of aluminum plate.
8. Thermal welding group: the thermal welding head is pushed up and down by the air cylinder, and the heat is provided by the heating hoop. The heating temperature is controlled by the cooperation of the temperature sensor and the temperature controller. The thermal welding head uses a small amount of spring to avoid damaging the module or uneven welding due to different card thickness. The relative position between the welding head and the card can adjust the right and first two eccentric positioning pins of the card clamp of the thermal welding group, The horizontal position of the clamp can be adjusted by four headless screws (jacking wire). The hot welding head can be divided into eight contact and six contact hot welding heads according to different modules. Similarly, there are two kinds of hot welding: double group and single group.
9. Cold welding group: this group mainly cools and flattens the IC module after hot welding to accelerate its bonding action.
10. IC detection group after packaging: detect whether the IC is sealed into the slot on the card, and detect the opening and short circuit electrical function. If the function is bad, throw the card into the waste box.
11. Receiving group: send the cards to the receiving clip and arrange the cards neatly by pushing the air cylinder.
SUZHOU DEGU MACHINERY CO.,LTD